For successful bonding, knowledge of adhesive methodology is essential. The most frequent causes for adhesive failure do not involve adhesive strength. Rather, they are attributed to inadequate preparation of the substrates and improper adhesive selection. The most important factor in proper adhesive selection is assessing the environment the adhesive must withstand. Once the environmental factors have been recognized, adhesive selection becomes more easily defined as other factors, such as joint design, substrates, load, stress cycles, etc., can often be varied or altered with minor design changes.
The following are the application solutions that fall under bonding:
- Hot Melts
- Light Cure Adhesives
- Modified Silanes
- Solvent - Based Adhesives
- Structural Acrylic Adhesives
- Structural Epoxy & Urethane Adhesives