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3M™ THERMAL BONDING FILMS

3M™ Thermal Bonding Films are heat activated bonding films ideal for low temperature bonding applications, such as bonding flex antenna and metal face plates to the chassis . It works on a variety of substrates, is reworkable and demonstrates excellent performance in drop tests.

3M™ has developed partnerships with bonding equipment suppliers who can custom design and build bonding cavities. Our global technical experts are available to help optimize your thermal bonding film die cut design and assembly processes.

THERMAL BONDING FILM

Style

Image

Features

Datasheet

583

High strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

  • Heat or solvent activation
  • Can be die-cut
  • Slight surface tack
  • Heat crosslinkable option
  • Lower temperature lamination of the nitrile phenolic film range

588

High strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly cross-linked using a post heat exposure.

  • Heat or solvent activation
  • Can be die-cut
  • Slight surface tack
  • Heat crosslinkable option

AF111

An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

  • Moderate tack
  • Thick 10 mil caliper
  • 250°F (121° C) cure
  • High metal OLS and peel adhesion
  • High flow
  • 40°F (4°C) storage required

AF42

High strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

  • 350°F (177°C) cure
  • Storage at or below 40°F (4°C)
  • Cures clear
  • Flexible for dissimilar substrates, high peel strength
  • Non tack, low flow
  • 3 mil and 4 mil thick versions